Please contact us and tell us about your specific requirements and wishes.
We will be happy to advise you on the right specification for your application.
Please call us on +49-(0)8191-478747 or contact us by E-Mail.
Special Services
We can offer you the following services
Wafer Laser dicing
Wafer (Kiru) Blade dicing
Wafer Grinding – Thinner and smaler – Ultra thin
Laser marking
Wafer reclaim
Special wafers or wafer processing
– Diameter or thickness
– Material properties: Doping / resistances
– Structures and geometry
– Special crystal orientation (tilt angle of the crystal plane)
Wafer carriers for fixing or handling standard wafers
– Si wafers as carriers
– Grinding of certain diameters
– Recesses (residual thicknesses of 0.25 mm possible)
– Wafer carriers made of quartz or ceramic
– Less arm
– Quartz / ceramic forks or grippers
Silicon rings (insert rings, focus rings, …) up to 18” wafer applications
Perforated disks (showerheads / electrodes) up to 18” wafer applications
